Toshiba 300mm Wafer Fab, NAND Flash Memory Fab-4November 17th, 2007 - 1:04 pm ICT by admin
Toshiba Corp. and SanDisk are building a new 300mm wafer fabrication facility at Toshiba’s Yokkaichi operations in Japan. The companies plan to start construction of the new facility, called Fab-4, in August 2006. Initial production operations are scheduled to begin in Q4 2007.
Toshiba will fund construction of the building, while both Toshiba and SanDisk will provide funds for the manufacturing equipment. Fab-4 will be similar in size to the companies’ Fab-3 300mm plant currently also operating at Yokkaichi.
Toshiba has increased its capital-spending budget several times over the last year, partly to fund expansion at Fab-3 and partly to fund Fab-4. In 2005, Toshiba announced an increase in capacity at Fab-3 from 10,000 to 30,000 300mm wafers/month: 40% higher than previously planned. That took an investment of nearly
Tags: 300mm wafer, 300mm wafers, aim, dominion semiconductor, fab 4, fund expansion, japan, joint venture, memorandum of understanding, micron, nand flash memory, production ramp, sandisk, semiconductor plant, toshiba, wafer fab, wafer fabrication facility